I. Research:
My research is pushing mainly in two fronts -- Manufacturing Technology Research and Advanced Device Development
A. Research & Development of Advanced Manufacturing Technology:
1. Research in mechanical Alignment System:
2. Development of a Novel Ultra-Precision Alignment System:
3. Research to Improve the Manufacturing Process in the Electronics
Industry:
4. Flexible tooling and fixtures for Mass Customization
(Collaboration with Ajay Joneja who is principle investigator in this
area)
B. Development of New Electronics Device & System
1. Development of multi-dimension high precision optical position monitoring
system
2. Research & Development of a New High Density R/W DVD Optical
Drive
3. Development a New Pressure Sensor for Biomechanical Application
4. Development of Differential g Load System for Disk Drive Head Manufacturing
5. Development of Non Intrusive G load Adjustment System
1 Precision Manufacturing
(Collaboration with Ajay Joneja, supervising Cai Yimin, Alfred Wong
and Martin Chen):
a. Successful development of a high resolution multi-dimensional displacement monitoring system:
To the best of our knowledge, most of the high resolution optical monitoring system can monitor only one or two dimensions. We may be the first to develop a high resolution system which can monitor up to six dimensions. The work is to be published in Optical Engineering.
b. Using the above, we have performed study of mechanical alignment system which is of course, very commonly used, but very little systematic research has been done before. We have found that it is possible to get submicron alignment precision with the mechanical alignment system. In industry, the common practice is only 10 to 20 um or about 50X higher. We have also found that the common practices of datum may not be adequate as it may serious degrade the alignment tolerance. The results of this work has been submitted to ASME, J of Manufact. Science and Engr.
c. We believe we have broken new ground in pushing the resolution of optical instrument. With the newly developed noise cancellation technique, we have successfully demonstrated that it is possible to achieve resolution below 20 angstrom. In contrast, system such as optical interferometer using the same helium neon laser may achieve only a few hundred angstrom which is more than an order nagnitude of difference.
d. We are working on the following factors that can
affecr the alignment precision.
2 Flexible tooling and fixtures for Mass
Customization
(Collaboration: Ajay Joneja who is principle investigator in this area)
a. Modular, Parametic feeding tools for Mass Customization
We have finished the design of the tooling and in the process of finishing
a paper in this area.
3 Ultra-high precision alignment system
(Collaboration: Prof. Ping Ko, Dr. Karim Saheed)
A novel new approach using atomic force microscope (AFM) has been developed
successfully. Today, there are two major approaches for alignment. They
are mechanical alignment and optical alignment. Our new approach may open
a new alignment method with atomic scale accuracy for manufacturing. This
approach has been reviewed by Prof. Ko and Dr. Karim. One very promising
important application of our teechnology is to produce the future generation
of wafer alignment machine. A patent application will be filed shortly.
4 Others projects:
a Thermal management for SMT (Surface amount technology) manufacturting.
b MEMS for biomechanical applications
(2) Research Funding
| Year(s) | PI/CI | #PI | #CI | Type | Sponor | Topic | Total Amount |
| 01-04 | PI | 1 | 1 | RGC | RGC | Precision Levels in Assembly Process – a comparative study |
387,248
|
| 99-02 | CI | 4 | 1 | ISF | HK Dept. of Industry | Development of Advanced Magnetic Materials and Related Componentsfor the Electrical/Electronics Industries |
10,060,000
|
| 99-00 | PI | 1 | 1 | DAG | RGC | Study of mechanical alignment process for manufacturing : Moving towards micron accuracy and beyond |
42,000
|
| 98-00 | PI | 1 | 1 | Competitive Earmarked Res. Grant | RGC | Study of Mechanical Alignment Process for Manufacturing Process: Moving towards Micron Accuracy and beyond |
473,000
|
| 98-00 | Manag | 2 | 1 | ISF | HK Dept.
of Industry |
Design and Development of a State of Art Automated Manufacturing Instrument and Equipment for Disk Drive Industry |
2,600,000
|
| 96-98 | PI | 2 | 0 | Indust. Grant | Chiang Industrial Charity
Foundation Ltd. |
Differential Heating Approach to the Surface Mount Technology Reflow Process for Better Yield and Throughput |
386,000
(US$ 50,000) |
| 96-99 | PI (Proj. Manager) | 6 | 0 | RIG | UPGC | Development of MicroDevice System & Technologies for Biomechanical Applications |
300,000
(800k for three years) |
| 96-97 | PI | 1 | 0 | Contract Res. | Respironics | Development of Thickness Control System for Air Filled Membrane Product |
250,000
|
| 95-96 | PI | 1 | 0 | DAG | RGC | Development of Real Time Optical Measurement Device for Manufacturing Precision Improvement |
30,000
|
| 95-98 | PI(*) | 4 | 0 | RIG | UPGC | Advanced Motion Control Systems for Microelectronics Apllications |
436,000
(1,354,200 for 3 years) |
| 94-95 | PI | 1 | 0 | DAG | RGC | Research and Development of High Precision Manufacturing Process |
54,177
|
(*) Weipei Li, Neville Lee, Li Qui, Matthew Yuen